Patent Assignment
Reel/Frame 025516/0016
Assignment of Assignor's Interest
Recorded: 2010-12-17
Pages: 5
Assignors
SAKAGUCHI, HIDEAKI
Executed: 2010-11-30
HIGASHI, MITSUTOSHI
Executed: 2010-11-30
TAGUCHI, YUICHI
Executed: 2010-11-30
SHIRAISHI, AKINORI
Executed: 2010-11-30
MURAYAMA, KEI
Executed: 2010-11-30
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same