Patent Assignment
Reel/Frame 025564/0916
Assignment of Assignor's Interest
Recorded: 2010-12-23
Received: 2010-12-23
Pages: 4
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1, HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Component and Method of Fabricating Semiconductor Component
Application:
12/977,982 →