IP Library Assignment 025582/0294
Patent Assignment
Reel/Frame 025582/0294

Assignment of Assignor's Interest

Recorded: 2011-01-04 Pages: 4
Assignors
YOO, HYUN JEE
Executed: 2010-12-30
KHO, DONG HAN
Executed: 2010-12-30
KIM, JANG SOON
Executed: 2010-12-30
PARK, HYO SOON
Executed: 2010-12-30
HONG, JONG WAN
Executed: 2010-12-30
JOO, HYO SOOK
Executed: 2010-12-30
Assignee
LG CHEM, LTD.
20, YOIDO-DONG, YOUNGDUNGPO-GU, SEOUL, 150-721, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Epoxy-Based Composition, Adhesive Film, Dicing Die-Bonding Film and Semiconductor Device
Patent: 9,659,763 →
Application: 12/989,353 →
Publication: US 2011/0111218
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 4, 2021
From: LG CHEM, LTD.
To: LG ENERGY SOLUTION, LTD.
Reel/Frame 058295/0068 →