Patent Assignment
Reel/Frame 025610/0960
Assignment of Assignor's Interest
Recorded: 2011-01-10
Pages: 4
Assignors
INFINEON TECHNOLOGIES AG
Executed: 2011-01-10
INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
Executed: 2011-01-10
Assignee
LANTIQ DEUTSCHLAND GMBH
AM CAMPEON 3, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication
Patent:
6,228,771 →
Application:
09/533,527 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2010
From: INFINEON TECHNOLOGIES AG
To: LANTIQ DEUTSCHLAND GMBH
Reel/Frame 024563/0680 →
Grant of Security Interest in U.S. Patents
Nov 29, 2010
From: LANTIQ DEUTSCHLAND GMBH
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 025406/0677 →
Release of Security Interest Recorded at Reel/Frame 025413/0340 and 025406/0677
Apr 17, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 035453/0712 →
Merger and Change of Name
Jan 17, 2018
From: LANTIQ DEUTSCHLAND GMBH; LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 045086/0015 →
Assignment of Assignor's Interest
Jul 20, 2020
From: LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: INTEL CORPORATION
Reel/Frame 053259/0678 →
Assignment of Assignor's Interest
Aug 27, 2020
From: INTEL CORPORATION
To: MAXLINEAR, INC.
Reel/Frame 053626/0636 →