IP Library Assignment 025632/0853
Patent Assignment
Reel/Frame 025632/0853

Assignment of Assignor's Interest

Recorded: 2010-12-24 Pages: 3
Assignors
CHEN, WEI
Executed: 2010-12-21
TAN, XIAOCHUN
Executed: 2010-12-21
Assignee
HANGZHOU SILERGY SEMICONDUCTOR TECHNOLOGY LTD
A1501 TECHNOLOGY MANSION, EAST SOFTWARE PARK, NO. 90 WENSAN ROAD, HANGZHOU, ZHEJIANG PROVINCE, 310012, CHINA
Covered Property (1)
Chip Package Structure and Method of Making the Same
Patent: 8,294,256 →
Application: 12/928,986 →
Publication: US 2011/0254143
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 20, 2012
From: HANGZHOU SILERGY SEMICONDUCTOR TECHNOLOGY LTD
To: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
Reel/Frame 029530/0305 →