Patent Assignment
Reel/Frame 025635/0452
Assignment of Assignor's Interest
Recorded: 2011-01-13
Pages: 2
Assignors
YASUI, TSUTOMU
Executed: 2011-01-04
ABE, HISAYUKI
Executed: 2011-01-04
KAWABATA, KENICHI
Executed: 2011-01-04
KITAMURA, TOMOKO
Executed: 2011-01-04
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Lead-Free Solder and Electronic Component Built-in Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.