Patent Assignment
Reel/Frame 025639/0402
Assignment of Assignor's Interest
Recorded: 2011-01-14
Pages: 3
Assignee
NITTO DENKO CORPORATION
1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Connection Structure of Electronic Component and Wired Circuit Board, Wired Circuit Board Assembly, and Method for Testing Electronic Component