Patent Assignment
Reel/Frame 025649/0425
Assignment of Assignor's Interest
Recorded: 2011-01-17
Pages: 4
Assignors
LIN, WEN-YI
Executed: 2011-01-12
LIN, PO-YAO
Executed: 2011-01-12
LIN, TSUNG-SHU
Executed: 2011-01-12
CHANG, KUO-CHIN
Executed: 2011-01-12
WANG, SHOU-YI
Executed: 2011-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Lid Design for Reliability Enhancement in Flip Chip Package