IP Library Assignment 025654/0312
Patent Assignment
Reel/Frame 025654/0312

Assignment of Assignor's Interest

Recorded: 2011-01-18 Pages: 6
Assignors
GRAHAM, DAVID
Executed: 2011-01-18
SINGH, JEANNE MARIE SALDANHA
Executed: 2011-01-18
PROVENCE, JOEL
Executed: 2011-01-18
WELLS, RICHARD D.
Executed: 2011-01-18
Assignee
LEXMARK INTERNATIONAL, INC.
740 NEW CIRCLE ROAD, BUILDING 82-1 LEGAL, LEXINGTON, KENTUCKY, 40550
Covered Property (1)
Die Attach Composition for Silicon Chip Placement on a Flat Substrate Having Improved Thixotropic Properties
Patent: 8,657,413 →
Application: 13/008,428 →
Publication: US 2012/0182355
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →