Patent Assignment
Reel/Frame 025658/0437
Assignment of Assignor's Interest
Recorded: 2011-01-19
Pages: 5
Assignors
JONES, ANDREW MICHAEL
Executed: 2010-12-16
RYAN, STUART
Executed: 2010-12-10
SCANDURRA, ALBERTO
Executed: 2011-01-12
Assignees
STMICROELECTRONICS (R&D) LTD
PLANAR HOUSE, PARKWAY GLOBE PARK, MARLOW, BUCKINGHAMSHIRE, SL7 1YL, UNITED KINGDOM
STMICROELECTRONICS SRL
VIA OLIVETTI 2, AGRATE BRIANZA (MILANO), 20041, ITALY
Covered Property
(1)
Integrated Circuit Package with Multiple Dies and a Multiplexed Communications Interface