IP Library › Assignment 025671/0135
Patent Assignment
Reel/Frame 025671/0135

Assignment of Assignor's Interest

Recorded: 2011-01-20 Pages: 4
Assignors
TOBISAKA, YUJI
Executed: 2010-12-27
KUBOTA, YOSHIHIRO
Executed: 2010-12-27
ITO, ATSUO
Executed: 2010-12-27
TANAKA, KOUICHI
Executed: 2010-12-27
KAWAI, MAKOTO
Executed: 2010-12-27
AKIYAMA, SHOJI
Executed: 2010-12-27
TAMURA, HIROSHI
Executed: 2010-12-27
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO 1000004, JAPAN
Covered Property (1)
Method for Manufacturing Bonded Wafer
Patent: 8,314,006 →
Application: 12/934,788 →
Publication: US 2011/0104871
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 28, 2022
From: THERATECHNOLOGIES INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 060655/0351 →
Release of Security Interest Dec 9, 2024
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
To: THERATECHNOLOGIES INC.
Reel/Frame 069528/0238 →