Patent Assignment
Reel/Frame 025681/0647
Assignment of Assignor's Interest
Recorded: 2011-01-24
Pages: 3
Assignor
KAO, CHING-HUNG
Executed: 2011-01-20
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Forming Trenches and Trench Isolation on a Substrate