Patent Assignment
Reel/Frame 025689/0448
Change of Name
Recorded: 2011-01-21
Received: 2011-01-21
Pages: 6
Assignor
PULSE ENGINEERING, INC.
Executed: 2010-10-29
Assignee
PULSE ELECTRONICS, INC.
12220 WORLD TRADE DRIVE, SAN DIEGO, CA, 92128, UNITED STATES
Covered Properties
(38)
Substrate Inductive Devices and Methods
Application:
12/503,682 →
Power-Enabled Connector Assembly and Method of Manufacturing
Application:
12/495,653 →
Self-leaded surface mount inductors and methods
Application:
12/229,676 →
Connector Keep-Out Apparatus and Methods
Application:
12/074,131 →
Integrated Connector Apparatus and Methods
Application:
12/074,112 →
Wire-Less Inductive Devices and Methods
Application:
11/985,156 →
Connector Antenna Apparatus and Methods
Application:
11/906,413 →
Universal Connector Assembly and Method of Manufacturing
Application:
11/827,074 →
Modular Electronic Header Assembly and Methods of Manufacture
Application:
11/399,002 →
Power-Enabled Connector Assembly with Heat Dissipation Apparatus and Method of Manufacturing
Application:
11/387,226 →
Precision Inductive Devices and Methods
Application:
11/213,461 →
Universal Connector Assembly and Method of Manufacturing
Application:
11/170,583 →
Compact Vehicle-Mounted Antenna
Application:
10/529,024 →
Precision Inductive Devices and Methods
Application:
10/990,915 →
Impedance Blocking Filter Circuit
Application:
10/748,729 →
Controlled Inductance Device and Method
Application:
10/666,580 →
Shielded Connector Assembly and Method of Manufacturing
Application:
10/417,743 →
Controlled Inductance Device and Method
Application:
10/381,062 →
Electronics Component Assembly
Application:
29/177,597 →
Electronics Component Package
Application:
29/177,596 →
Shielded Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/371,059 →
Impedance Blocking Filter Circuit
Application:
10/366,656 →
Antenna Mounting System
Application:
10/300,539 →
Electronic Packaging Device and Method
Application:
10/263,900 →
Advanced Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/246,840 →
Method of Manufacturing Electronic Packaging Device with Insertable Leads
Application:
10/242,066 →
Connector with Insert Assembly and Method of Manufacturing
Application:
10/139,907 →
Advanced Microelectronic Connector Assembly and Method of Manufacturing
Application:
10/099,645 →
Advanced Electronic Signal Conditioning Assembly and Method
Application:
10/096,605 →
Alarm Filter Circuit
Application:
10/013,218 →
Telecommunications Gateway and Method
Application:
09/975,142 →
Electronic Packaging Device
Application:
09/947,176 →
Electronics Housing Elements
Application:
29/141,570 →
Alarm Filter Circuit
Application:
09/848,654 →
Antenna Mounting System
Application:
09/825,089 →
Method of Manufacturing an Improved Microelectronic Package
Application:
09/794,263 →
Electronic Packaging Device with Insertable Leads and Method of Manufacturing
Application:
09/773,134 →
Connector Assembly with Side-by-Side Terminal Arrays
Application:
09/757,112 →