Patent Assignment
Reel/Frame 025717/0645
Assignment of Assignor's Interest
Recorded: 2011-01-28
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Multi-Chip Package Having a Substrate with a Plurality of Vertically Embedded Die and a Process of Forming the Same