Patent Assignment
Reel/Frame 025738/0245
Assignment of Assignor's Interest
Recorded: 2011-02-03
Pages: 3
Assignors
SATO, HIROYUKI
Executed: 2011-01-12
MURATA, TOMOHIKO
Executed: 2011-01-12
NAGAYA, FUSAJI
Executed: 2011-01-12
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board