Patent Assignment
Reel/Frame 025800/0807
Assignment of Assignor's Interest
Recorded: 2011-02-14
Received: 2011-02-14
Pages: 3
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2011-01-27
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Property
(1)
Structure for Connecting Interconnect Lines with Interposed Layer Including Metal Layers and Metallic Compound Layer
Application:
09/978,005 →