Assignment of Assignor's Interest

Recorded: 2011-02-24 Pages: 3

Assignor

Executed: 2011-02-17

Assignee

POLYMER VISION B.V.

HIGH TECH CAMPUS 48, EINDHOVEN, 5656 AE, NETHERLANDS

Covered Property (1)

Semiconductor Device with a Variable Integrated Circuit Chip Bump Pitch

Application: 12/699,644 →

Publication: US 2011/0186899

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.