Assignment of Assignor's Interest

Recorded: 2011-02-28 Pages: 5

Assignors

LEE, JOONGHUI

Executed: 2011-02-01

JANG, SOOYEUP

Executed: 2011-02-01

OH, JEONKEUN

Executed: 2011-02-14

Assignee

SK INNOVATION CO., LTD.

99, SEORIN-DONG, JONGNO-GU, SEOUL, 110-110, KOREA, REPUBLIC OF

Covered Property (1)

Fixing Structure of Multi-Layer Printed Circuit Board

Patent: 8,477,510 →

Application: 13/061,405 →

Publication: US 2011/0170271

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.