Patent Assignment
Reel/Frame 025916/0928
Assignment of Assignor's Interest
Recorded: 2011-03-08
Pages: 3
Assignor
ERK, HENRY F.
Executed: 2011-02-23
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, MAIL ZONE 33, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Methods for Reducing the Deposition of Silicon on Reactor Walls Using Peripheral Silicon Tetrachloride
Application:
12/977,739 →
Publication:
US 2011/0158888
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Security Agreement
Feb 28, 2014
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 032372/0610 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →