IP Library › Assignment 025950/0194
Patent Assignment
Reel/Frame 025950/0194

Assignment of Assignor's Interest

Recorded: 2011-03-09 Pages: 8
Assignor
Assignee
HUGHES ELECTRONICS CORPORATION
200 NORTH SEPULVEDA BLVD., PO BOX 956, BLDG 001 MS A109, EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Ceramic-Polymer Composite Material and Its Use in Microelectronics Packaging
Patent: 5,945,470 →
Application: 08/950,718 →
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 5, 2011
From: HUGHES ELECTRONICS CORPORATION
To: THE BOEING COMPANY
Reel/Frame 025589/0991 →
Assignment of Assignor's Interest Aug 1, 2011
From: THE BOEING COMPANY
To: EPHALION FUND LIMITED LIABILITY COMPANY
Reel/Frame 026680/0262 →
Merger Jan 19, 2016
From: EPHALION FUND LIMITED LIABILITY COMPANY
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037526/0293 →
Assignment of Assignor's Interest Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest Feb 1, 2020
From: GULA CONSULTING LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 052159/0463 →