Patent Assignment
Reel/Frame 025953/0776
Assignment of Assignor's Interest
Recorded: 2011-03-10
Pages: 3
Assignor
KAMISASA, TOSHIO
Executed: 2011-03-03
Assignees
DAIWABO HOLDINGS CO., LTD.
6-8, KYUTAROMACHI, 3-CHOME, CHUO-KU, OSAKA-SHI, OSAKA 541-0056, JAPAN
DAIWABO POLYTEC CO., LTD.
6-8, KYUTAROMACHI, 3-CHOME, CHUO-KU, OSAKA-SHI, OSAKA 541-0056, JAPAN
Covered Property
(1)
Fiber Assembly, Composite of Electro Conductive Substrate and Fiber Assembly, and Production Methods Thereof