IP Library › Assignment 025986/0585
Patent Assignment
Reel/Frame 025986/0585

Assignment of Assignor's Interest

Recorded: 2011-03-20 Pages: 4
Assignors
OH, HYEOK-SANG
Executed: 2010-12-01
JANG, WOO-JIN
Executed: 2010-12-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Forming Integrated Circuit Devices Having Damascene Interconnects Therein with Metal Diffusion Barrier Layers and Devices Formed Thereby
Patent: 8,232,200 →
Application: 13/051,732 →
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 20, 2011
From: CHENG, TIEN-JEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 025986/0626 →
Assignment of Assignor's Interest Mar 20, 2011
From: CHOI, JI-HONG; OH, MINSEOK
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 025986/0629 →
Assignment of Assignor's Interest Oct 4, 2011
From: MOON, BUM-KI
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 027009/0376 →
Assignment of Assignor's Interest Nov 18, 2011
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 027249/0812 →