Assignment of Assignor's Interest

Recorded: 2011-03-23 Pages: 2

Assignor

UEMATSU, HIROYUKI

Executed: 2011-03-22

Assignee

TDK CORPORATION

1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN

Covered Property (1)

Multi-Layer Wiring Board and Method of Manufacturing Multi-Layer Wiring Board

Application: 13/069,741 →

Publication: US 2011/0232942

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.