Assignment of Assignor's Interest

Recorded: 2011-03-29 Pages: 3

Assignors

HONG, PIL SOON

Executed: 2011-03-21

PARK, GWUI-HYUN

Executed: 2011-03-21

KIM, SANG GAB

Executed: 2011-03-21

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU,, GYEONGGI-DO,, SUWON-SI, KOREA, REPUBLIC OF

Covered Property (1)

Flattening Method of a Substrate

Patent: 8,450,160 →

Application: 13/074,296 →

Publication: US 2012/0149158

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.