Patent Assignment
Reel/Frame 026041/0960
Assignment of Assignor's Interest
Recorded: 2011-03-29
Pages: 2
Assignors
HU, YU-SHAN
Executed: 2011-01-10
HU, DYI-CHUNG
Executed: 2011-01-10
TSENG, TZYY-JANG
Executed: 2011-01-10
Assignee
UNIMICRON TECHNOLOGY CORPORATION
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property
(1)
Packaging Substrate Having Through-Holed Interposer Embedded Therein and Fabrication Method Thereof