Patent Assignment
Reel/Frame 026061/0545
Assignment of Assignor's Interest
Recorded: 2011-04-01
Pages: 3
Assignors
ZHANG, YANG
Executed: 2011-02-03
PENG, YONGSHENG
Executed: 2011-02-03
STEENSTRA, JACK B.
Executed: 2011-02-03
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT/CENTRAL ADMINISTRATION, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Modular Surface Mount Package for a System on a Chip