Patent Assignment
Reel/Frame 026080/0409
Assignment of Assignor's Interest
Recorded: 2011-04-06
Pages: 3
Assignor
LEE, JONG-JOO
Executed: 2011-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Stacked Structure Semiconductor Device Having Through-Silicon via and Signaling Method for the Semiconductor Device