Assignment of Assignor's Interest

Recorded: 2011-03-25 Pages: 2

Assignor

YAMAUCHI, TOSHIKAZU

Executed: 2011-02-22

Assignee

OKI SEMICONDUCTOR CO., LTD.

550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Wafer holding apparatus and method

Application: 13/064,446 →

Publication: US 2011/0232075

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.