Patent Assignment
Reel/Frame 026102/0398
Assignment of Assignor's Interest
Recorded: 2011-04-11
Pages: 26
Assignors
RAJAGOPALON, NAGARAJAN
Executed: 2011-02-15
PARK, JI AE
Executed: 2011-02-15
YAMASE, RYAN
Executed: 2011-03-04
PATEL, SHAMIK
Executed: 2011-02-23
NOWAK, THOMAS
Executed: 2011-02-15
XIA, LI-QUN
Executed: 2011-03-02
KIM, BOK HOEN
Executed: 2011-02-22
DING, RAN
Executed: 2011-02-22
BALDINO, JIM
Executed: 2011-04-05
NAIK, MEHUL
Executed: 2011-03-04
RAMASWANI, SESH
Executed: 2011-02-24
Assignee
APPLIED MATERIALS, INC.
P. O. BOX 450A, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Fabrication of Through-Silicon Vias on Silicon Wafers