IP Library Assignment 026132/0193
Patent Assignment
Reel/Frame 026132/0193

Assignment of Assignor's Interest

Recorded: 2011-04-14 Pages: 2
Assignor
YU, YANG
Executed: 2011-04-01
Assignee
HANGZHOU H3C TECHNOLOGIES, CO., LTD., HUAWEI HANGZHOU MANUFACTURING BASE
310 LIHUE ROAD, ZHIJIANG HI-TECH PARK, HANGZHOU HI-TECH INDUSTRY DEVELOPMENT ZONE, HANGZHOU, ZHEJIANG 310053, CHINA
Covered Property (1)
Method and System for Communication Capacity Negotiation of Physical Layer Chips
Patent: 8,654,647 →
Application: 13/119,888 →
Publication: US 2011/0188519
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 22, 2016
From: H3C TECHNOLOGIES CO., LTD.; HANGZHOU H3C TECHNOLOGIES CO., LTD.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 039767/0263 →