Patent Assignment
Reel/Frame 026160/0045
Assignment of Assignor's Interest
Recorded: 2011-04-21
Pages: 5
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
System-In-Package Using Embedded-Die Coreless Substrates, and Processes of Forming Same