Patent Assignment
Reel/Frame 026227/0007
Assignment of Assignor's Interest
Recorded: 2011-05-04
Pages: 3
Assignors
LIN, WEI-FENG
Executed: 2011-04-28
HO, WEN-JEN
Executed: 2011-04-28
LEE, CHI-KUEI
Executed: 2011-04-28
TSAI, CHEN-WEI
Executed: 2011-04-28
Assignee
OMNIVISION TECHNOLOGIES, INC.
4275 BURTON DR., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Reinforcement Structure for Wafer-Level Camera Module