Patent Assignment
Reel/Frame 026235/0199
Assignment of Assignor's Interest
Recorded: 2011-04-21
Pages: 2
Assignor
TONOMOTO, MASAYA
Executed: 2011-04-06
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device Accomodating Semiconductor Module with Heat Radiation Structure