IP Library Assignment 026235/0631
Patent Assignment
Reel/Frame 026235/0631

Assignment of Assignor's Interest

Recorded: 2011-05-06 Pages: 4
Assignors
ANDERSON, FRANK EDWARD
Executed: 2008-04-10
BERNARD, DAVID LAURIER
Executed: 2008-04-10
DRYER, PAUL WILLIAM
Executed: 2008-04-10
JOYNER, BURTON LEE, II
Executed: 2008-04-10
MCNEES, ANDREW LEE
Executed: 2008-04-10
STRUNK, TIMOTHY LOWELL
Executed: 2008-04-10
SULLIVAN, CARL EDMOND
Executed: 2008-04-10
Assignee
LEXMARK INTERNATIONAL, INC.
740 WEST NEW CIRCLE ROAD, BUILDING 82-1 LEGAL, LEXINGTON, KENTUCKY, 40550
Covered Property (1)
Heater Chips with Silicon Die Bonded on Silicon Substrate
Patent: 8,087,756 →
Application: 13/102,091 →
Publication: US 2011/0205305
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →