Patent Assignment
Reel/Frame 026308/0909
Assignment of Assignor's Interest
Recorded: 2011-05-19
Pages: 2
Assignee
HITACHI PLANT TECHNOLOGIES, LTD.
5-2 HIGASHI-IKEBUKURO 4-CHOME, TOSHIMA-KU,, TOKYO, JAPAN
Covered Property
(1)
Micro-Bump Forming Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.