IP Library Assignment 026329/0407
Patent Assignment
Reel/Frame 026329/0407

Assignment of Assignor's Interest

Recorded: 2011-05-24 Pages: 8
Assignors
MCCONNELL, JOHN E.
Executed: 2011-05-20
BULTITUDE, JOHN
Executed: 2011-05-20
PHILLIPS, REGGIE
Executed: 2011-05-20
HILL, ROBERT ALLEN
Executed: 2011-05-20
RENNER, GARRY L.
Executed: 2011-05-20
LESSNER, PHILIP M.
Executed: 2011-05-20
CHACKO, ANTONY P.
Executed: 2011-05-20
BELL, JEFFREY
Executed: 2011-05-20
BROWN, KEITH
Executed: 2011-05-20
Assignee
KEMET ELECTRONICS CORPORATION
PO BOX 5928, GREENVILLE, SOUTH CAROLINA, 29606
Covered Property (1)
Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering and Polymer Solder Pastes
Patent: 8,902,565 →
Application: 13/114,126 →
Publication: US 2011/0292567
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
Release of Security Interest Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →