Patent Assignment
Reel/Frame 026384/0161
Assignment of Assignor's Interest
Recorded: 2011-06-03
Pages: 2
Assignors
CHIANG, CHIANG-CHENG
Executed: 2007-07-19
HUANG, CHIENG-PING
Executed: 2007-07-19
CHANG, CHIN-HUANG
Executed: 2007-07-19
CHIU, CHI-HSIN
Executed: 2007-07-19
HUANG, JUNG-PIN
Executed: 2007-07-19
Assignee
SILICON PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Multi-Chip Stack Structure Having Through Silicon Via
Application:
13/151,823 →
Publication:
US 2011/0227226
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.