IP Library › Assignment 026498/0396
Patent Assignment
Reel/Frame 026498/0396

Change of Name

Recorded: 2011-06-20 Pages: 5
Assignor
DOW GLOBAL TECHNOLOGIES INC.
Executed: 2010-12-31
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Epoxy Resin Compositions Having Improved Low Temperature Cure Properties and Processes and Intermediates for Making the Same
Patent: 8,759,457 →
Application: 12/935,026 →
Publication: US 2011/0020555
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 7, 2011
From: WOTHKE, JEAN C.; EHREISER, MANUELA; ULRICH, HEROLD
To: DOW DEUTSCHLAND GMBH & CO. OHG
Reel/Frame 026089/0905 →
Assignment of Assignor's Interest Jun 20, 2011
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 026479/0547 →
Assignment of Assignor's Interest Jun 20, 2011
From: DOW DEUTSCHLAND GMBH & CO. OHG
To: THE DOW CHEMICAL COMPANY
Reel/Frame 026480/0848 →
Assignment of Assignor's Interest Jun 11, 2015
From: DOW GLOBAL TECHNOLOGIES LLC
To: BLUE CUBE IP LLC
Reel/Frame 035887/0193 →