Patent Assignment
Reel/Frame 026503/0461
Assignment of Assignor's Interest
Recorded: 2011-06-22
Pages: 3
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Plating Method
Application:
13/165,865 →
Publication:
US 2011/0315555
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.