IP Library Assignment 026523/0993
Patent Assignment
Reel/Frame 026523/0993

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2011-06-29 Received: 2011-06-29 Pages: 4
Assignors
BAE, JOHYUN
Executed: 2011-06-22
HAN, BYUNG JOON
Executed: 2011-06-22
YOON, IN SANG
Executed: 2011-06-22
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/166,802