Assignment of Assignor's Interest

Recorded: 2011-06-29 Received: 2011-06-29 Pages: 4

Assignors

CHUA, LINDA PEI EE

Executed: 2011-06-21

DO, BYUNG TAI

Executed: 2011-06-21

TRASPORTO, ARNEL SENOSA

Executed: 2011-06-21

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE

Covered Properties (2)

Integrated Circuit Packaging System with Thermal Emission and Method of Manufacture Thereof

Application: 13/166,809 →

Posterior Functionally Dynamic Stabilization System

Application: 11/952,575 →