IP Library Assignment 026533/0336
Patent Assignment
Reel/Frame 026533/0336

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2011-06-30 Received: 2011-06-30 Pages: 4
Assignors
CHI, HEEJO
Executed: 2011-06-15
CHO, NAMJU
Executed: 2011-06-15
SHIN, HANGIL
Executed: 2011-06-15
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTRA SUBSTRATE DIE AND METHOD OF MANUFACTURE THEREOF
App. No. 13/162,513