Patent Assignment
Reel/Frame 026575/0977
Assignment of Assignor's Interest
Recorded: 2011-07-12
Pages: 3
Assignee
PANASONIC ELECTRIC WORKS CO., LTD.
1048, OAZA-KADOMA, KADOMA-SHI,, OSAKA, JAPAN
Covered Property
(1)
Method of Mounting Semiconductor Chips, Semiconductor Device Obtained Using the Method,Method of Connecting Semiconductor Chips, Three-Dimensional Structure in Which Wiring Is Provided on Its Surface, and Method of Producing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.