IP Library Assignment 026576/0504
Patent Assignment
Reel/Frame 026576/0504

Assignment of Assignor's Interest

Recorded: 2011-07-12 Pages: 2
Assignors
LIU, JINSHUI
Executed: 2011-06-27
YU, TIAN
Executed: 2011-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Hybrid Cooling Design for Modular Systems
Patent: 8,854,814 →
Application: 13/169,941 →
Publication: US 2012/0327597
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Data Previously Recorded on Reel 026576 Frame 0504. Assignor(S) Hereby Confirms the Correct Receiving Party Data. Jul 13, 2011
From: LIU, JINSHUI; YU, TIAN
To: FUTUREWEI TECHNOLOGIES, INC.
Reel/Frame 026582/0164 →