Patent Assignment
Reel/Frame 026582/0324
Assignment of Assignor's Interest
Recorded: 2011-07-13
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Apparatus and Method for Increasing Bandwidths of Stacked Dies