Patent Assignment
Reel/Frame 026598/0009
Assignment of Assignor's Interest
Recorded: 2011-07-15
Pages: 4
Assignors
LEE, CHUNG-SUN
Executed: 2011-06-08
KIM, JUNG-HWAN
Executed: 2011-06-08
IM, YUN-HYEOK
Executed: 2011-06-08
HWANG, JI-HWAN
Executed: 2011-06-08
KIM, HYON-CHOL
Executed: 2011-06-08
CHOI, KWANG-CHUL
Executed: 2011-06-08
CHOI, EUN-KYOUNG
Executed: 2011-06-08
MIN, TAE-HONG
Executed: 2011-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Package and Semiconductor Package Including the Same