IP Library Assignment 026599/0131
Patent Assignment
Reel/Frame 026599/0131

Assignment of Assignor's Interest

Recorded: 2011-07-15 Pages: 2
Assignors
HARAO, AKIRA
Executed: 2011-06-02
MATSUNAGA, MOTOTATSU
Executed: 2011-06-02
SUGIURA, YASUHIRO
Executed: 2011-06-02
KUBOTA, MINORU
Executed: 2011-06-02
Assignee
YAZAKI CORPORATION
4-28, MITA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Wiring Substrate and Manufacturing Method Thereof
Patent: 9,888,558 →
Application: 13/152,419 →
Publication: US 2011/0299250
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →