Patent Assignment
Reel/Frame 026617/0478
Assignment of Assignor's Interest
Recorded: 2011-07-18
Pages: 3
Assignors
KANG, UK-SONG
Executed: 2011-06-26
JANG, DONG-HYEON
Executed: 2011-06-26
JANG, SEONG-JIN
Executed: 2011-06-26
LEE, HOON
Executed: 2011-06-26
KIM, JIN-HO
Executed: 2011-06-26
KIM, NAM-SEOG
Executed: 2011-06-26
MOON, BYUNG-SIK
Executed: 2011-06-26
LEE, WOO-DONG
Executed: 2011-06-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SOUTH, KOREA, REPUBLIC OF
Covered Property
(1)
3D Semiconductor Device