Assignment of Assignor's Interest

Recorded: 2011-07-22 Pages: 2

Assignors

HORIKAWA, YUHEI

Executed: 2011-07-08

YOSHIDA, KENICHI

Executed: 2011-07-08

SATO, ATSUSHI

Executed: 2011-07-13

Assignee

TDK CORPORATION

1-13-1, NIHONBASHI CHUO-KU, TOKYO 103-8272, JAPAN

Covered Property (1)

Terminal Structure, Printed Wiring Board, Module Substrate, and Electronic Device

Patent: 8,816,213 →

Application: 13/189,062 →

Publication: US 2012/0044651

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.