Patent Assignment
Reel/Frame 026644/0607
Assignment of Assignor's Interest
Recorded: 2011-07-25
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2011-06-22
LIN, JING-CHENG
Executed: 2011-06-22
LIU, NAI-WEI
Executed: 2011-06-22
HUNG, JUI-PIN
Executed: 2011-06-22
JENG, SHIN-PUU
Executed: 2011-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Interconnect Structure for Wafer Level Package